There are rumors that the Huawei Mate 9 will come with the Kirin 970 chipset, which will have the highly efficient 10 nm FinFET process from chip manufacturer Taiwan Semiconductor Manufacturing Company, Limited, (TSMC).

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There are also speculations that the Mate 9 will feature a Kirin 960 chipset which is supposed to come with ARM Cortex A73 Artemis cores and Cortex A53 cores. It will also have an upgraded GPU with a possibility of an octa-core processor and new LTE baseband that has support from Cat. 12 and CDMA. It will be manufactured on TSMC's 16 nm process.

According to GizChina, the above mentioned 10 nm chipset could be competing against the MediaTek's Helio X30 as being one of the first new processors to be used for the smaller and more efficient manufacturing process. The Kirin 970 chipset will support the Cat. 12 LTE and Cat. 6 and will run on a Mali-G71 GPU.

If the company continues its tradition, then Huawei Mate S2 is a gentle upgrade to the Huawei Mate 8 flagship, and Mate 9 with a powerful hardware would likely be released near the end of this year; around November to December period. The Mate S2 is expected to be unveiled in the first week of September. There is a possibility that Huawei will use the Kirin 960 for its upper mid-range smartphones like Mate S2 and the Kirin 970 for Mate 9 and the succeeding top-end flagships next year, Gizmo China reported.

Tagshuawei mate 9, Mate 9, TSMC, Kirin 970, Kirin 960, Huawei Mate S2, Mate S2, Huawei Mate 8, Mate 8