As part of China's strategy to free itself of its dependence on the United States, Japan, and Korea for memory technologies, the country is planning to build a domestic memory manufacturing facility. Reports indicate that China is planning to license 3D NAND technology from Micron, an American global corporation.

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According to DigiTimes, Tsinghua Unigroup is working alongside Wuhan Xinxin Semiconductor Manufacturing Corporation to produce NAND flash chips, including 3D NAND. As part of this effort, Tsinghua and XMC are currently negotiating with Micron to license the latter's 3D NAND technology.

Many market analysts have noted that Micron might be persuaded to agree with the proposal of the Chinese tech firms. Micron has had poor quarterly results and the looming deal from China could provide a necessary revenue boost to the company. By agreeing to the deal with the Chinese firms, Micron could also receive a proportion of the whole 3D NAND output from the Tsinghua-XMC deal.

There are reports claiming that Tsinghua Unigroup has been quite busy in negotiations with a handful of tech companies in its effort to make its own memory technology facility. The company was previously reported to have been talking with Toshiba and SK Hynix, but none of the talks have been beneficial to its cause.

According to The Register, Tsinghua Unigroup allegedly to have made an offer of $23 billion last year to buy Micron. However, the deal was rejected by the United States government.

Tagschina, 3D NAND, Memory, 3D NAND memory, memory technology, Micron