New leaks emerged from China recently, claiming that Apple is testing at least five different iPhone 7 versions.

The iPhone 7 release date is still unknown but speculations on the Internet are claiming several possible changes for the upcoming iPhone.

According to the recent 10-Q filing, a huge RF content increase is expected in the upcoming iPhones. The Apple iPhone 7 may use Qualcomm's X12 LTE modem that has download speeds of up to 600 megabits for second, which is twice that of the iPhone 6's MDM9x35 and upload speeds of up to 150 megabits per second, which is thrice that of the abovementioned CPU.

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TSMC is also the exclusive A10 chip driver of the iPhone 7, highlighting its integrating fan out packaging that mounts a stack of chips on top of each other directly to the motherboard. It would reduce the vertical board height, allowing for an even thinner smartphone.

The iPhone 7 is also believed to have dual rear cameras for optical zoom rather than the existing digital zoom.

The phone's fingerprint recognition is also said to come to the main display screen to ditch the home button and allow for an even smaller frame.

Other rumors include a USB Type-C port and a 3.5 millimeter headphone jack that may possibly ditch the Earpods. The new headphone port is said to need a Lightning plug or a Bluetooth Wireless connection.

Other leaks point to wireless charging support but it is still unclear if the Cupertino tech giant will create its own or will adopt the existing wireless charging standards currently in the market.

There are also speculations that Apple is already testing a 3D Touch technology for its alleged water resistant iPhone 7. The next generation Apple flagship device is expected to be launched globally in Fall of 2016.

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