Chinese telecommunications equipment certification center TENAA has apparently listed the highly anticipated smartphone, the LeEco Le2S. The upcoming flagship smartphone from LeEco appeared on a leak from TENAA, and it shows the device's all-metal body and its dual camera configuration, which resembles a smiling emoji.

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The rear facing dual camera of the LeEco Le2S is located in the upper middle part of the device, according to Giz China. It sports a very interesting design which, at a quick glance, can look like a smiling head. Just below the camera is the fingerprint scanner.

The front panel of the LeEco Le2S sports a very minimalist design. No physical button is visible.

Not much is known about the Le2S smartphone since LeEco has been very silent about the specs of its upcoming flagship device. However, rumors indicate that the smartphone would have a Qualcomm Snapdragon 820 chipset with 4GB of memory, and 32GB of storage space.

The Le2S is expected to sport a 16-megapixel rear facing sensor and an 8-megapxiel front-facing selfie shooter. The device is rumored to have a 5.5-inch with a 1920 x 1080 resolution. The Le2S is expected to run on the company's EUI 6 OS, which is based on the Android 6.0 Marshmallow.

The LeEco Le2S is expected to be released within the coming weeks.

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