A handful of new photos believed to be that of the upcoming LeEco Le2 flagship smartphone were recently spotted on Chinese social networking platform Weibo. The photo reveals the full metal build of the device, with a fingerprint scanner located on the back. There are also rumors that the smartphone would have a powerful Qualcomm Snapdragon 821 chipset under its hood.

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The recently leaked photos were shared by someone who claims have close ties with LeEco. The images gave the tech community its first unofficial image of the upcoming smartphone from LeEco. The source was also kind enough to share some important tidbits regarding the phone's hardware specs.

It appears that LeEco is playing a safe game with the Le2. Unlike other smartphone manufacturers like Xiaomi, Huawei, and Meizu, that have started to adopt the dual camera setup, the LeEco Le2 only has a single rear facing camera. Moreover, the fingerprint scanner is ideally situated on the rear panel of the smartphone rather than on the front Home button.

A side shot of the LeEco Le2 shows that the device's screen runs all the way up to the very edge of the phone, leaving many tech analysts to believe that it might sport a bezel-less design.

Based on the leaked info, the LeEco Le2 will have a 5.5-inch screen with 1080 x 1920 resolution. Complementing the Snapdragon 821 chipset is 4GB of memory and 32GB of internal storage space. Sources close the company claim that the smartphone would have a 16-megapixel rear facing main camera and an 8-megapixel front facing selfie shooter.

According to Giz China, the LeEco Le2 is slated to be launched on Sept. 6.

TagsLeeco, LeEco Le2, Le2, Le2 leak, Le2 specs, LeEco Le2 specs